FLYING PROBE TESTER FA1823

FLYING PROBE TESTER FA1823
HIOKI

FLYING PROBE TESTER FA1823

SKU: 50Category: HIOKI

Enabling Reliable 4-wire Testing of Ultra-Fine Pads on Advanced IC Substrates

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Product Description

The FA1823 is an advanced flying probe tester designed for high-precision inspection of next-generation IC package substrates and high-density circuit boards. It enables accurate probing of ultra-fine pads and supports 4-terminal Kelvin low-resistance measurement, helping detect subtle resistance variations and improve inspection reliability. With four probe arms and high positioning precision, the FA1823 supports efficient double-sided testing for demanding semiconductor and electronics manufacturing applications. It is ideal for IC package substrates, semiconductor manufacturing, R&D, quality control, and mass production, where precise testing of fine-pitch pads is required.

Specifications

Arms: 4 (2 Top + 2 Bottom) Min. Pad Size: 1 µm* Min. Pad Pitch: 24 µm Positioning Resolution: 0.1 µm Test Speed: Up to 76 points/s Test Steps: Up to 999,999 Board Thickness: 0.5–7.0 mm Max. Test Area: 280 × 260 mm Power: 200–240 V AC, 5 kVA Weight: Approx. 1600 kg

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